Package Technical Manager (mediatek)
mediatek HsinChu, Taiwan(China)
2024-09-11
Job posting number: #150107 (Ref:MTK120240423000)
Job Description
Description
• New product implementation, especially in Advanced package, FO, FCCSP and wire bonding products• Assembly yield improvement
• Assembly issue and RMA resolving
• Package technology development and process improvement
View Orignal JOB on: italents.net
Requirements
• At least have more than 8 years relevant work experiences (Advanced package, FCCSP, FO, Wire bond packaging development)• RnD/Process experience from IC design house, assembly house and/or Substrate manufacturing for packaging development purpose.