3DIC Advance Package Design Engineer (mediatek)
mediatek HsinChu, Taiwan(China)
2024-09-11
Job posting number: #150239 (Ref:MTK120240515001)
Job Description
Description
10+ years experiences in IC Advance Package Design such as 3DIC Development, ASIC (APR) design, flow development, and EDA enablementKEY RESPONSIBILITIES:
Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design.
Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance.
Support package design teams in defining a tool roadmap for advanced package design.
Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility.
Represent the Package design team in customer engagements for advanced package designs.
Requirements
1. Strong experience in APR coding specific to ICC2 (or 3DIC Compiler) or Innovus (or Integrity 3DIC).2. Very good knowledge of EDA tools programming skills: TCL, PERL or SKILL, and Python programming.
Experience in interposer design for 2.5D, CoWoS, InFO, and other 3D advanced packaging technologies.
3. Experience in collaborating with layout engineers for substrate design and layout using Cadence APD.
4. Good communication and presentation skills for executive project coordination.
5. Good understanding of Signal Integrity and Power Integrity principles is a plus.
6. Experience in working with assembly, foundry, and substrate vendors is a plus.
7. Experience in 3DIC PDK development and enablement is a plus.