Advanced Package Technologiest (mediatek)
mediatek HsinChu, Taiwan(China)
2024-12-07
Job posting number: #159903 (Ref:MTK120241015000)
This Job Posting is Expired.
Job Description
Description
Develop advanced package technologies for MediaTek's HPC businessRequirements
Familiar with 2.5D/3D Package architecture and advanced packaging technologies such as COWOS/EMIB, SoIC, CoW, WoW technology family.Familiarity with 3DIC advanced package materials, production process and supplier chain management, including BOM management , procurement, logistics, and inventory.
Deep knowledge of electrical, mechanical and thermal properties of 3DIC advanced package developing and production.
Familiar with all legacy packaging technologies.